CN

CN

Column

About Us: About; History; Honor

Product: TMBS Photovoltaic Products; BSI Wafer Processing; Color filter & Micro lens; SOI Products; Special Bonding Service; MEMS pressure sensor

Technology: Bsi Customized Services; Hybrid Bond & Fusion Bond; Micro Lens Simulation Technology; Optical Simulation Technology; Tmbs Design Capability

News: Company News; Exhibition activities

Job: Job; Office

Contact Us: Contact us; Map positioning; Message

technology

Core technology

Dedicated to providing BSI, SOI, and specialized chip level processing services for 200mm and 300mm wafer manufacturing

Core technology

TMBS Design Capability

YCMEC can customize and develop TMBS products with different sizes and performance parameters according to customer needs.

Low forward pressure drop product

VF（130mil）＜450mv（20A）

VF（150mil）＜440mv（20A）
Low reverse leakage products

IR（180mil）＜10uA（45V）
Special size products

Customized development of products in different sizes

105mil/122mil/186mil/190mil
Alien products

Customized development 2mm*9mm/3mm*8mm Alien products
Special pressure resistant specification products

40V/55/65V Different gear products