Core technology

Hybrid Bond & Fusion Bond

YCMEC owns a complete 8-inch BSI product processing line, covering all processes including bonding pretreatment, bonding, anneal, thinning, wet etching, CMP, ALD, ARC, and Pad Open. This full-flow process capability significantly enhances the quantum efficiency of image sensors.

Project	Capability
Bond force	≥1.8J/m2
Empty	≤0.5%
Alignment accuracy	≤800nm
Thinning TTV	≤3um
Final TTV	≤0.5um
ARC uniformity	≤3%
Pad Open accuracy	≤2um

Wafer information

The customer provides CIS and Handle wafer
Characteristic

High alignment accuracy up to 800nm, CIS requires customers to provide surface planarization wafers
Technological process

Wafer bonding+wafer thinning+ARC layer deposition (Pad Open process can be developed)