Changguang Yuanchen Microelectronics Technology Co., Ltd. (YCMEC), founded on December 29, 2016 with a registered capital of 410 million RMB, YCMEC is headquartered in Changchun, Jilin Province, China. As an independent semiconductor manufacturer, we specialize in BSI CMOS image sensor processes, power device fabrication, and customized product manufacturing.
Core Business
We are committed to providing BSI, SOI, and specialized chip-level processing services for 200mm and 300mm wafers. Additionally, we support R&D and manufacturing of Color Filter & Micro Lens processes, sales of TMBS photovoltaic products, and offer extensive customized process technologies based on customer needs.
Technical Advantages
Leveraging the latest international technologies and advanced equipment, we have successfully developed CIS processing technologies for 8-inch and 12-inch wafers under 0.18μm process, with mature BSI technology foundations. In 2020, we pioneered Color Filter & Micro Lens processes, supporting CF & ML design, R&D, and manufacturing. In 2022, our TMBS products achieved mass production after successful development.
Development Positioning
We specialize in R&D and manufacturing of BSI CMOS image sensor chips for mid-to-high-end applications, while engaging in power device production for the commercial market.

History
2025
● China Industry University Research Cooperation Innovation Figure Award
● In April 2025, the TMBS production capacity reached 25000 pieces per month

2024
● Jilin Province's "Specialized, Refined, Unique and New" Small and Medium sized Enterprises
● Advanced Collective in Talent Work in Changchun City
● Annual shipments of TMBS products exceed 200 million pieces

2023
● TMBS products enter mass production
● Won the second prize in the Growth Enterprise Group of the 12th China Innovation and Entrepreneurship Competition Jilin Division
● Selected as one of the top 500 small and medium-sized enterprises in the 8th "Maker China" Innovation and Entrepreneurship Competition in China

2022
● TMBS product development successful
● Changchun City's "Specialized, Refined, Unique and New" Enterprise

2021
● First Prize of Jilin Provincial Science and Technology Award
● Outstanding Scientific and Technological Achievement Award of the Chinese Academy of Sciences

2020
● High tech enterprises
● ISO 14001:2015 Environmental Management System Certification Passed
● ISO 45001:2018 Occupational Health and Safety Management System Certification Passed
● Successful development of color filter and micro lens technology

2019
●12 inch hybrid bonding process successfully developed

2018
● ISO 9001:2015 Quality Management System Certification Passed
● September: The first batch of 8-inch&12 inch BSI and SOI samples will be shipped successively
● December: BSI devices' electrical parameters meet customer requirements, and BSI products are officially put into production

2017
● April: Infrastructure construction begins
● November: The factory building is completed and the equipment is officially moved in

2016
● YCMEC officially established

Honor
- Certificate of honor
- Patent certificate
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High tech Enterprise Certificate
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Changchun Specialized, Refined, Unique and New Enterprise
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Outstanding Scientific and Technological Achievement Award of the Chinese Academy of Sciences
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Mr. Li - Industry University Research Innovation Figure Award
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Changchun Advanced Collective of Talents
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Second Prize in Enterprise Group
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Member Unit of Jilin Province Electronic Information Manufacturing Industry Innovation and Development Alliance
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Growth Group - Second Prize
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Semifinal certificate
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First Prize of Jilin Provincial Science and Technology Award
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Changguang Yuanchen Quality System Certificate
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Changguang Yuanchen Quality System Certificate
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ISO14001 Environmental Management System Certificate
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A wafer bonding force testing method for image sensor fabrication
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A wafer transfer system and method
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A trench Schottky diode and its preparation method
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A method for mixing and integrating heterogeneous materials of different sizes
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A method for aligning and bonding SOI silicon wafers
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Glue coating and cleaning equipment
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Rubber hose clamping device
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Method for improving wafer bonding strength based on BSI process
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Wafer backside thinning method based on BSI technology
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Chemical mechanical polishing solution and its application
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Activation method of silicon corrosion solution
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CMOS image sensor packaging carrier