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SOI Products
YCMEC offers 200mm and 300mm SOI manufacturing services on our standard production line.
Leveraging bonding and thinning processes, we manufacture SOI products with customizable top silicon and buried oxide thicknesses.
Leveraging bonding and thinning processes, we manufacture SOI products with customizable top silicon and buried oxide thicknesses.
Product details
8/12 inch SOI process: wafer edge grinding - wafer bonding - wafer thinning
Alignment accuracy: ≤ 50um, top silicon thickness ≥ 2um, buried oxide thickness 100nm-5um, particle size ≤ 30ea@0.2um
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| CSAM result: No gaps>2mm | Top view of wafer: wafer edge trimming 2.5mm |