BSI Wafer Processing

YCMEC owns the full BSI flow for 8 inch and 12inch wafers, covering processes such as pre-bonding treatment, bonding thinning, anti-reflective coating (ARC) deposition, and pad opening. Additionally, our capabilities extend to 8inch Fusion Bond, 12inch Fusion Bond, and 12inch Hybrid Bond technologies.

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Product details

8 inch BSI Wafer Processing：Fusion&Hybrid Bond

Bonding accuracy：3σ≤800nm（depends on wafer）

12 inch Wafer Processing：Fusion&Hybrid Bond

Bonding accuracy：3σ≤500nm（depends on wafer）

BSI Product Process

8 inch Fusion Bond	12 inch Fusion Bond	12 inch HYB Bond
Wafer Trimming	Wafer Trimming	Surface Treatment
Wafer Fusion Bonding	Wafer Fusion Bonding	Cu electroplating and CMP
Wafer Thinning	Wafer Thinning	Wafer Hybrid Bonding
Wet Etch	Wet Etch	Wet Etch
CMP	CMP	CMP
ARC	ARC	ARC
Pad Open	Pad Open	Pad Open

8 inch Wafer Products: YCMEC has offered 8inch BSI wafer processing to a wide range of domestic and international customers. Our services cover diverse Si thicknesses, anti-reflective coating (ARC) structures, and die sizes, with stitching process capability.

12 inch Wafer Products: YCMEC has BSI process capabilities for 12inch Fusion Bond and Hybrid Bond, as well as bonding capability for products of various sizes.

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BSI Wafer Processing